INDUSTRIAL 5G EDGE GATEWAY / iR730B SERIES

Trusted by the field.
Evolved for 5G.Trusted bythe field.Evolved for 5G.

The compact enclosure and industrial I/O philosophy of the iR700B platform, evolved for 5G Multi-RAT while making the most of existing field infrastructure.

Explore evolution→Contact IDY→

iR730BINDUSTRIAL 5G EDGE GATEWAY

5G Multi-RAT5G + LTE

77.9 × 125 × 24.8 mmCOMPACT PLATFORM

1GbE × 2LAN / LAN-WAN

JIS E 4031RAILWAY ENVIRONMENT

01 / PLATFORM EVOLUTION

Keep the field.
Evolve the network.

Carry forward the compact fixed-installation concept and industrial I/O philosophy of the iR700B family while evolving the radio platform to 5G Multi-RAT.

LEGACY PLATFORMiR700B / iR720B

LTE / RS232・RS485 / DIO / Ethernet

→

5G EVOLUTIONiR730B Series

Retain industrial I/O and evolve to 5G Multi-RAT

Evolve the network. Preserve the field-proven platform concept.

02 / 5G MULTI-RAT

Use LTE today.
Move into 5G.

A Multi-RAT platform designed for the transition period, allowing field systems to use LTE and 5G networks according to the deployment.

LEGACYLTE

Use established coverage

NEXT5G

Expand to carrier / local 5G

iR730B5G Multi-RAT

One platform for the transition

REL.16 PERFORMANCERel.16 5G performance, selectable for the deployment.

Both iR730B-101 and -102 are Release 16 models, with different carrier aggregation capabilities.

iR730B-101 / REL.162CC CA120MHz

Release 16 5G Multi-RAT in a compact industrial platform.

iR730B-102 / REL.163CC CA200MHz

The same 3CC CA / 200MHz carrier-aggregation specification as iR800B-102.

SAME 3CC CA / 200MHz AS iR800B-102

iR730BCOMPACT / INDUSTRIAL I/O / MIGRATION

≠

iR800B10GbE / EDGE COMPUTING / REDUNDANCY

03 / FANLESS THERMAL ENGINEERING

Cool 5G.
Without a fan.

IDY uses a six-layer sandwich thermal structure that conducts heat from the 5G RF module into the enclosure. Fanless cooling eliminates moving parts while supporting stable industrial 5G operation.

FANLESS / NO MOVING PARTSRemove moving parts. Remove one more cause of downtime.

Instead of relying on a cooling fan, a six-layer thermal path transfers heat into the enclosure — a thermal design developed for long-term industrial operation.

FANLESSNO MOVING PARTS

6-LAYERSANDWICH THERMAL DESIGN

45°C REDUCTION89°C → 44°C / 25°C AMBIENT

010203040506

Only numbered markers are placed on the exploded view; descriptions are kept separate for readability.

THERMAL PERFORMANCE / 25°C AMBIENT

WITHOUT HEATSINK89°C

→

TOP ALUMINUM HEATSINK44°C

45°C REDUCTION89°C → 44°C / Modem peak temperature reduced by 45°C

Move heat into the enclosure.

01Aluminum thermal jacket02Aluminum thermal block03Thermal pad045G RF module05Thermal pad06Aluminum thermal frame

iR730B-001 (FN980m), 25°C ambient. Comparison of no-heatsink and top-side aluminum-heatsink configurations. No migration occurred with the top aluminum heatsink.

HIGH TEMPERATURE VERIFICATIONAt 60°C ambient: modem max 80°C, no migration.

Thermal performance is verified with real hardware even under high ambient temperatures.

INDUSTRIAL DESIGN PHILOSOPHYFanless is not about silence.
It is about staying operational.

04 / 5G GENERATION EVOLUTION

One platform.
Multiple 5G generations.

From Release 15 to Release 16 and Release 17, the iR730B platform continues to evolve for long-lived industrial systems.

2019 / FIRST GENERATIONRel.15

iR730B-001 / 002

The first iR730B 5G generation.

CURRENT GENERATIONRel.16

iR730B-101 / 102

iR730B-101: 2CC CA / 120MHz. iR730B-102: 3CC CA / 200MHz.

FY2026 / REDCAPRel.17

iR730B-105

A RedCap model bringing LTE Cat.4-class data performance and 5G-native capabilities to industrial equipment. Planned for FY2026.

NEXT GENERATION / BROADBANDRel.17

iR730B-107

A Release 17 broadband model powered by FN990B40.

05 / INDUSTRIAL RELIABILITY

Not just vibration.
Test while connected.

Railway vibration and shock testing was performed while monitoring OTA connectivity and ping, followed by functional and internal inspection.

iR730B vibration test — ACTUAL TEST PHOTOiR730B mounted on the test fixture while connectivity is monitored during vibration and shock testing.

TESTED WHILE CONNECTEDConnectivity monitored throughout vibration testing.

01LTE OTATester connected

02PINGPC link monitored

03X / Y / Z5 h / axis

0418 SHOCKS±3 / axis

05PASSFunction / visual / internal

RAILWAY VIBRATIONJIS E 4031:2013

Class 1A / PASS

EMC IMMUNITYIEC 61000-4

Six immunity categories

EMIVCCI Class B

PASS

06 / PRODUCT & INTERFACES

Connect new networks
to existing equipment.

Ethernet, serial and digital I/O connect existing industrial equipment to 5G networks.

FRONT INTERFACESOperation, maintenance & status

01020304

USB 2.0 Host ×1Maintenance / expansion

RESET buttonRestart / recovery

MODE buttonMode control

STATUS LEDsAUX / WWAN / STAT / PWR

REAR INTERFACESNetwork & industrial connectivity

01020304050607080910

DC IN5V–16V

AUX ANT 2AUXILIARY

ANT 45G / LTE

RS232/485DIO 1 / DIO 2

LAN1GbE

LAN/WAN1GbE

ANT 35G / LTE

AUX ANT 1AUXILIARY

ANT 15G / LTE

ANT 25G / LTE

07 / SPECIFICATIONS

Industrial 5G Edge Gateway.
Compact by design.

Alongside 5G Sub-6, Gigabit Ethernet and industrial I/O, WISE CONNECT® supports modular expansion, including modules tailored to customer applications, in a compact edge gateway.

PATENTJapan Patent No. 7317562 / Communication deviceThe iR730B Series is covered by this patent.

5G GENERATION3GPP Rel.16iR730B-101 / -102

MOBILE NETWORK5G Sub-6UMTS / LTE / 5G

ETHERNET1GbE × 2LAN / LAN-WAN

PLATFORMWISE CONNECT®Varies by product model

COMPACT SIZE77.9 × 125× 24.8 mm

OPERATING TEMP.-10°C to +60°CGuaranteed operating range

TECHNICAL SPECIFICATIONSiR730B SERIES

01MOBILE
NETWORK

ModelsiR730B-001 / -002 / -101 / -102

3GPPiR730B-001 / -002 : Rel.15
iR730B-101 / -102 : Rel.16

Mobile NetworkUMTS / LTE / 5G Sub-6GHz

5G mmWaveNot included in the standard specification

GNSS / GPSOptional (antenna / firmware / consultation)

02NETWORK

Ethernet1GbE LAN × 1 / 1GbE LAN-WAN × 1

Expansion InterfaceWISE CONNECT® (depending on model and module specifications)

AntennaSMA connector × 6

03INDUSTRIAL
INTERFACE

USBUSB 2.0 × 1

Serial / DIORS232 / RS485 / DIO1 / DIO2 × 1

DisplayPower / Status / WWAN / AUX LEDs

ButtonsMODE switch / RESET switch

04POWER &
ENVIRONMENT

Power InputDC 5V–16V / AC adapter: DC12V output

Size77.9 × 125 × 24.8 mm

WeightApprox. 320g incl. WISE CONNECT® module, antenna and AC adapter

Power ConsumptionApprox. 20W max. (5G/LTE + LAN)

Operating Temperature-10°C to +60°C

Storage Temperature-20°C to +70°C

Humidity10% ～ 95% RH (non-condensing)

EnvironmentJIS D1601:1995 / JIS E 4031:2013

WIRELESS WAN BANDSCertified bands by model

MODELUMTSLTE5G FR1 / Sub-6GHz

iR730B-001—B1 / B3 / B8 / B18 / B19 / B26 / B28 / B39 / B41 / B42n3 / n28 / n41 / n77 / n78 / n79

iR730B-002—B1 / B3 / B5 / B8n3 / n28 / n77 / n78 / n79

iR730B-101 / -102B1 / B8 / B19B1 / B3 / B8 / B18 / B19 / B26 / B28 / B39 / B40 / B41 / B42n1 / n3 / n28 / n40 / n41 / n77 / n78 / n79

Bands vary by product model, communication specification and certification. The table summarizes certified bands stated in the product brochure. Consult the detailed model specification for additional supported bands, 5G mmWave and GNSS/GPS.

Product catalogR16L / JAPANESE↗

COMPACT. INDUSTRIAL. EVOLVABLE.Evolve existing industrial systems to 5G.

08 / RELATED PRODUCTS