We measure each path from radio reference throughput through product internals, USB or PCIe, operating systems and applications, then engineer thermal, mechanical and recovery performance into the finished product.
Using the same MT8000A radio conditions, IDY measures iR800B 10GbE routing, iperf3 running inside iR800B, and iS201B connected directly to a PC. Radio reference throughput is distinguished from throughput measured through each product and path.
The iR800B routing results under the public-network-aligned DL profile are analyzed by thread count, zero-copy and packet steering. USB remains stable with fewer threads, while PCIe reaches peak performance through multi-threaded parallel processing.
Host controlled. Zero-copy with fewer threads produced stable throughput, while driver-level device recovery remains practical.
DMA based. Multiple threads and rps_cpus achieved a peak approximately 20% above USB, but recovery requires operating-system and kernel-level reinitialization.
Results are measurements from the stated test configurations. iperf3 runs on the LAN-side PC for iR800B routing, inside iR800B for the standalone gateway test, and on the directly connected PC for iS201B. Because measurement points and paths differ, these figures are not a simple like-for-like product comparison. The standard iR800B configuration uses USB because device recovery matters alongside peak throughput.
With ambient temperature around 30°C, an iR800B ran iperf3 traffic for approximately 70 minutes. Effective downlink throughput was around 1.7 Gbps. Internal modem and PA temperatures rose, then broadly settled in the 60°C range.
This chart reconstructs approximate modem and PA temperatures from the approximately 70-minute internal test record. It does not show CPU temperature or a throughput time series. The approximately 1.7 Gbps effective downlink rate applies to this test configuration and is not a guaranteed rating.
In a separate internal test, iperf3 downlink traffic ran for one hour across four USB and PCIe configurations, covering routing and standalone-board paths. Without an external Peltier cooler on the product enclosure, end-of-test modem temperature was approximately 61–65°C, PA temperature 62–65°C, and CPU temperature 71–78°C.
Conditions: iperf3 -R -Z -P 16 -t 3600; the enclosure was cooled to approximately 40°C before testing. Ranges show end-of-test temperatures across four configurations. A throughput drop with suspected thermal effects in the test setup was also recorded. These observations do not guarantee sustained throughput across all paths or stability beyond the test duration. This test is separate from the approximately 70-minute study above.
iS201B connects directly over USB not only to PCs, but also to drones, AGVs and AMRs, machine tools and control equipment running Windows or Linux. IDY implements 5G as a complete system spanning the operating system, drivers, antennas, communications settings and application processing.
Measurement, video and edge processing
Video transmission and remote control
Mobile and autonomous transport
Equipment connectivity and remote monitoring
The same iS201B USB architecture extends across Windows and Linux equipment for different applications, supported by a common product, driver and validation foundation.
Measurement conditions: 5G SA n79, 2CC CA 200MHz, 4×4 MIMO, with iS201B connected directly to a PC over USB. Target equipment requires a compatible operating system, USB interface, driver and power configuration.
The iR730B uses a six-layer sandwich thermal structure engineered across the complete product to transfer 5G heat into the enclosure. IDY compared configurations with and without the heatsink and validated operation at high ambient temperature to achieve stable fanless operation without moving parts.
No migration occurred with the top aluminum heatsink configuration, suppressing thermal throttling even at high ambient temperature.
Comparison conditions: iR730B-001, 25°C ambient, comparing maximum 5G subsystem temperature without a heatsink and with a top aluminum heatsink. High-temperature validation was performed at 60°C ambient.
The iR800B is tested for railway and automotive vibration environments through functional, endurance and shock testing on the X, Y and Z axes. Communications and interfaces are monitored during testing, followed by functional, external and internal inspection.
ACTUAL TEST PHOTOFunctional vibration, five-hour endurance testing on each axis and shock testing all passed, including 30G / 18 ms transport and handling shock.
ACTUAL TEST PHOTOEvaluated to classifications 1A / 1B / 2A / 2B at acceleration level 30. The unit passed 3.0G functional and endurance testing on every axis and all post-test inspections.
Refer to product specifications for applicable models, standards and detailed test conditions. Vibration and shock testing does not guarantee uninterrupted operation under every installation and operating condition.
IDY combines industrial communication product development with engineering knowledge spanning base-station and RAN technologies, including PHY and protocol stacks. We engineer products, RF, antennas, embedded software, network access and recovery control as one resilient field system.
Understand radio-access behavior beyond the device side.
Optimize the radio system across spectrum, propagation and installation.
Develop industrial gateways and communication devices across hardware and embedded software.
Embed link decisions, switching, recovery and monitoring into operations.
Understanding radio access, devices, antennas and operations together is what turns connectivity into a system that keeps working in the field.
IDY validates the complete system, from radio access and wireless links through in-product communications, embedded SoCs, operating systems, applications and real operating environments. We apply that accumulated engineering knowledge to products and solutions that help society keep communicating.
Qualcomm is a trademark or registered trademark of Qualcomm Incorporated. Microsoft and Windows are trademarks of the Microsoft group of companies. Linux is the registered trademark of Linus Torvalds in Japan and other countries. All other company and product names are trademarks or registered trademarks of their respective owners.